This presentation will demonstrate several defects that can be identified and quantified with 3D scanning inside a hole. Interface and exit-burr heights were measured with the scanner and compared to CMM data. Surface defects were also cataloged. Additional hole measurements obtained by 3D scanning and conventional touch gauges were compared to CMM measurements. By combining the ability to measure hole dimensions and quantify defects that are not apparent by simple measurement techniques, time can be saved by eliminating eyes-on inspection.
- The function of 3D hole inspection technology and its impact on the airframe assembly process
- The impact of 3D hole scanning on assembly throughput and cost reduction associated with its ability to eliminate destack before fastening
- Why 3D hole scanning is an enabler of automated systems for the assembly of complex airplane parts